Chip antenna module array and chip antenna module
US11128031B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2020 |
| Grant date | Sep 21, 2021 |
| Priority date | — |
| Expiry date | Mar 18, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q25/00
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A chip antenna module array includes a connection member and chip antenna modules mounted on the connection member. Each chip antenna module includes: a first patch antenna dielectric layer; a feed via extending through the first patch antenna dielectric layer; and a patch antenna pattern disposed on an upper surface of the first patch antenna dielectric layer and configured to be fed from the feed via. At least one chip antenna module includes: a ground pattern disposed on a lower surface of the first patch antenna dielectric layer; a chip-antenna feed line including a second part disposed on a lower surface of the ground pattern, and electrically connecting a connection member feed line to the feed via; a first feed line dielectric layer disposed on a lower surface of the second part; and a solder layer disposed on a lower surface of the first feed line dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.