Patent · US Active

Transistor outline package with ground connection

US11128101B2 · kind B2 · utility

2Cited by

4References

26Claims

0Family size

Assignee

Schott AG · DE

Inventors

Robert Hettler · Kumhausen, DE
Artit Aowudomsuk · Bangkok, TH
Kenneth Tan · Calabasas, US
Karsten Droegemueller · Eichenau, DE

Key dates

Filing date	Aug 27, 2019
Grant date	Sep 21, 2021
Priority date	—
Expiry date	Aug 27, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01S5/06226
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A transistor outline package is provided that includes a header having an upper surface, a lower surface, an inner surface, and a mounting area for an optoelectronic component in the inner surface. The header has a signal pin configured to connect an optoelectronic component. The signal pin is disposed in a feedthrough and protrudes from the lower surface. A printed circuit board attached on the signal pin substantially coaxially thereto. The printed circuit board is mechanically and electrically connected to the header by a metal block arranged adjacent to the feedthrough to provide grounding.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.