Socket assembly, light emitter module, and lighting system
US11129276B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 10, 2018 |
| Grant date | Sep 21, 2021 |
| Priority date | — |
| Expiry date | Jun 7, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10106
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A socket assembly comprises a base frame formed of a thermally conductive material holding a light emitting diode (LED) package to a support structure, a contact element electrically contacting the LED package, and an isolator PCB. The LED package includes an LED PCB having an LED mounted on the LED PCB. The base frame includes a base mounted to the support structure and mechanically engaging the LED PCB so that the LED package is attached to the support structure with a predetermined holding force. The contact element electrically connects the isolator PCB to the LED PCB. The isolator PCB supplies electrical power to the LED. The isolator PCB has a first surface and a second surface; the second surface is in heat transmitting contact with the base frame and the electronic component is disposed on the first surface of the isolator PCB and electrically connected to the LED.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.