Flexible circuit film and electronic device comprising the same
US11129281B2 · kind B2 · utility
2Cited by
1References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2019 |
| Grant date | Sep 21, 2021 |
| Priority date | — |
| Expiry date | Oct 2, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10128
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible circuit film, which is capable of preventing broken portions during an assembly process, and an electronic device comprising the same is disclosed. The flexible circuit film comprises a bonding pad portion, a body portion, and a film bending portion between the bonding pad portion and the body portion, wherein at least some portion of the film bending portion has a thickness that is less than a thickness of the body portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.