Process for liquid immersion cooling
US11129298B2 · kind B2 · utility
2Cited by
60References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2019 |
| Grant date | Sep 21, 2021 |
| Priority date | — |
| Expiry date | Sep 19, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/44
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A two-phase liquid immersion cooling method is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using a pressure controlled vessel and pressure controller, a cooling system may be operated at less than ambient pressure. By controlling the pressure at which the system operates, the user may influence the temperature at which the dielectric fluid vaporizes and thereby achieve increased performance from a given computer component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.