Component mounter
US11129315B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2017 |
| Grant date | Sep 21, 2021 |
| Priority date | — |
| Expiry date | Oct 2, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0409
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component mounter of the present disclosure including a mounting head configured to pick up components and mount the components onto a substrate; a head moving device configured to move the mounting head in parallel to a horizontal plane; and a conveyance device configured to convey the substrate in a conveyance direction parallel to the horizontal plane. The mounting head includes multiple nozzles configured to pick up and hold the components by a negative pressure, multiple switching valves provided corresponding to each of the multiple nozzles and configured to switch whether the negative pressure is supplied to the corresponding nozzle, a nozzle moving device configured to change which nozzle is positioned at each of a first nozzle position and a second nozzle position for moving the multiple nozzles and performing at least one of picking up and mounting of the components, a first driving device, and a second driving device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.