Patent · US Active

Method for integrating an electrical circuit in a device and device

US11129639B2 · kind B2 · utility

0Cited by

2References

10Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Jana Blaesius · Ludwigsburg, DE
Aitor Echaniz · Stuttgart, DE
Martin Schoepf · Stuttgart, DE
Michael Walther · Phoenix, US

Key dates

Filing date	Jul 25, 2018
Grant date	Sep 28, 2021
Priority date	—
Expiry date	Jul 25, 2038

Classification

Technology area (CPC A)Human Necessities
CPC primaryA61B17/3211
WIPO fieldMedical technology
WIPO sectorInstruments

Abstract

A method integrates an electrical circuit into a device. The device has an integration surface consisting of a first material. The method includes processing the integration surface in order to form connection elements in order to increase an adhesion of a second material to the integration surface. The second material differs from the first material. The method also includes arranging the electrical circuit adjacent to the processed integration surface. The method furthermore includes applying a volume of the second material at least over the integration surface in order to enclose the electrical circuit in a fluid-tight manner.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.