Device and method for laser-assisted processing of bodies or surfaces
US11130199B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2017 |
| Grant date | Sep 28, 2021 |
| Priority date | — |
| Expiry date | Dec 26, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70416
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A device performs laser-assisted processing of a material adhering to a substrate or of a substrate associated or substrate-free body or of its surface. The device has a positioning system enabling three translational and three rotational degrees of freedom and having a sample holder. The sample holder holds the substrate to which the material to be processed adheres or to which the body to be processed is associated or, in the absence of a substrate, the body to be processed. The device has a laser source emitting laser pulses and focusing optics which shape the laser pulses such that they impinge in a focal point or a focal volume in the region of the material or body to be processed in such a way that a two-photon or multi-photon polymerization takes place.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.