Multi-layer device assembly system
US11130328B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2019 |
| Grant date | Sep 28, 2021 |
| Priority date | — |
| Expiry date | Jan 17, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30108
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer device assembly system including a substrate source, a plurality of dispenser modules, a feeder, a control system having a number of alignment cameras corresponding to the dispenser modules, an inspection camera, and a defect camera. The substrate source provides a substrate having a plurality of base elements. Each dispenser module includes an actuation mechanism configured to laminate a layer element onto one of the base elements or onto a previously laminated layer element. The feeder metes out the substrate from the substrate source to advance each base to a subsequent dispenser module between lamination steps. The control system determines alignments, defects, and lamination errors via the alignment cameras, inspection camera, and defect camera.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.