Patent · US Active

Middle member of heat dissipation device and the heat dissipation device

US11131508B2 · kind B2 · utility

2Cited by
3References
38Claims
0Family size

Assignee

Inventor

Key dates

Filing dateOct 3, 2018
Grant dateSep 28, 2021
Priority date
Expiry dateJan 23, 2039

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldThermal processes and apparatus
  • WIPO sectorMechanical engineering

Abstract

A middle member of heat dissipation device and the heat dissipation device. The middle member includes a middle member main body having a first face, a second face, multiple perforations and a channeled structure assembly. The channeled structure assembly is disposed on the first face or the second face. The perforations are formed through the middle member main body between the first and second faces. The channeled structure assembly and the perforations are arranged in alignment with each other or not in alignment with each other. The middle member and a first plate body and a second plate body are overlapped with each other to form the heat dissipation device. The complex structures disposed on the first and second faces of the middle member main body are able to achieve a stable vapor-liquid circulation effect.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.