Embedded bridge substrate having an integral device

US11133256B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Amit Jain · Marlboro, US
• Sameer Shekhar · Portland, US
• Chin Lee Kuan · Bentong, MY
• Kevin J. Doran · North Plains, US
• Dong-Ho Han · Beaverton, US

Key dates

• Filing date: Jun 20, 2019
• Grant date: Sep 28, 2021
• Expiry date: Jun 20, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15192
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Microelectronic assemblies, related devices, and methods are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate; a bridge, embedded in the package substrate, wherein the bridge includes an integral passive component, and wherein a surface of the bridge include first contacts in a first interconnect area and second contacts in a second interconnect area; a first die coupled to the passive component via the first contacts in the first interconnect area; and a second die coupled to the second contacts in the second interconnect area.