Electronic device with segmented housing having molded splits

US11133572B2 · kind B2 · utility

Assignee

• Apple Inc. · US

Inventors

• Yaocheng Zhang · Cupertino, US
• John J. Baker · Campbell, US
• Martin J. Auclair · Cupertino, US
• Paul U. Leutheuser · Saratoga, US
• Christopher J. Durning · Cupertino, US
• Jun Ham · San Jose, US

Key dates

• Filing date: Nov 29, 2018
• Grant date: Sep 28, 2021
• Expiry date: Mar 8, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H04B2001/3894
• WIPO field: Telecommunications
• WIPO sector: Electrical engineering

Abstract

The disclosure is directed to a multi-segment housing for an electronic device that includes multiple conductive segments that are structurally coupled by one or more non-conductive housing segments or splits. One or more of the conductive segments may be configured to operate as an antenna and the non-conductive housing segments may provide electrical insulation between the conductive segment and one or more adjacent housing segments. The non-conductive housing segment may be formed from a polymer having an array of fibers dispersed within the polymer. The fibers may be aligned along one or more fiber directions, which may be substantially perpendicular to an exterior surface of the housing.