Automated installation of electronic devices on infrastructure components
US11133708B1 · kind B1 · utility
1Cited by
0References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 2, 2019 |
| Grant date | Sep 28, 2021 |
| Priority date | — |
| Expiry date | Aug 18, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V20/10
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
The disclosed apparatus may include (1) a mount of an infrastructure component, where the mount includes an installation surface that contacts an installed electronic device, and (2) a coupling mechanism that (a) provides a force causing a corresponding installation surface of the installed electronic device to maintain contact with the installation device, and (b) delivers electrical power via the installation surface to the installed electronic device. Various other apparatuses, devices, and methods are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.