Method and apparatus for LDPC transmission over a channel bonded link
US11133893B2 · kind B2 · utility
1Cited by
7References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 25, 2019 |
| Grant date | Sep 28, 2021 |
| Priority date | — |
| Expiry date | Nov 25, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L2001/0096
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
A particular overall architecture for transmission over a bonded channel system consisting of two interconnected MoCA (Multimedia over Coax Alliance) 2.0 SoCs (Systems on a Chip) and a method and apparatus for the case of a “bonded” channel network. With a bonded channel network, the data is divided into two segments, the first of which is transported over a primary channel and the second of which is transported over a secondary channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.