Circuit board assemblies for electronic devices
US11134591B2 · kind B2 · utility
3Cited by
17References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2019 |
| Grant date | Sep 28, 2021 |
| Priority date | — |
| Expiry date | Dec 26, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10606
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board assembly for electronic devices includes a circuit board having a first surface and a second surface opposite the first surface, and a heat sink carrier disposed on the first surface of the circuit board. The heat sink carrier includes at least one clamp portion. The assembly also includes a heat sink. The heat sink is positioned in the at least one clamp portion of the heat sink carrier to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.