Luminaire including a heat dissipation structure
US11134618B2 · kind B2 · utility
0Cited by
8References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2017 |
| Grant date | Oct 5, 2021 |
| Priority date | — |
| Expiry date | Apr 24, 2037 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF21Y2115/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
There are provided luminaire assemblies and methods of assemblies thereof. For example, there is provided a luminaire assembly including a hollow core and an overmolded thermal dissipation structure molded over the hollow core.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.