Ultrasonic bonding apparatus and ultrasonic bonding method using the same
US11135779B2 · kind B2 · utility
1Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 2020 |
| Grant date | Oct 5, 2021 |
| Priority date | — |
| Expiry date | May 29, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0285
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An ultrasonic bonding apparatus includes a stage on which a display panel is seated, a first ultrasonic generation unit which is connected to the stage and vibrates in a first direction and provide a first polarization, and a second ultrasonic generation unit in which an electronic component is seated and which vibrates in a second direction that is crossed with the first direction, and provides a second polarization, where a third polarization is provided on a plane on which the display panel contacts the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.