System for impressing a relief pattern on a substrate
US11135803B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 25, 2017 |
| Grant date | Oct 5, 2021 |
| Priority date | — |
| Expiry date | May 4, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB44B5/026
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A die and counter die system for impressing a relief pattern onto a substrate, including at least one male die including a contact surface and defining a relief pattern, a compressible counter film including a base layer, a contact layer disposed opposite the contact surface of the at least one male die and spaced therefrom, and a compressible layer disposed between the base layer and the contact layer and attached thereto. The contact layer is featureless in a region thereof opposing the relief pattern on the at least one male die. The compressible counter film has a compressibility, in a direction perpendicular to a broad face of the compressible counter film, in the range of 5-30% at 1.35 MPa. The system further includes a compression mechanism adapted to move the at least one male die and the compressible counter film towards one another in an operative mode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.