Multilayer composite comprising a fluoropolymer layer

US11135821B2 · kind B2 · utility

Assignee

• Evonik Operations GmbH · DE

Inventors

• Jasmin Berger · Dortmund, DE
• Rainer Goering · Borken, DE
• Klaus Gahlmann · Marl, DE
• Michael Boeer · Olfen, DE
• Mario Resing · Stadtlohn, DE

Key dates

• Filing date: Mar 17, 2016
• Grant date: Oct 5, 2021
• Expiry date: Jun 21, 2036

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08K3/041
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A multilayer composite containing the following layers: I. a first layer (layer I) of a moulding compound containing at least 40 wt. % of the following components: 1) 60 to 99 parts by wt. of a copolyamide based on hexamethylenediamine, terephthalic acid and an aliphatic dicarboxylic acid having 8 to 19 carbon atoms and 2) 40 to 1 parts by wt. of an olefinic copolymer as impact modifier, wherein the parts by wt. of 1) and 2) sum to 100; and II. a second layer (layer II) of a moulding compound containing at least 60 wt. % of fluoropolymer, has a high heat distortion temperature, a very good impact resistance, a high elongation at break and good layer adhesion.