Heat pump system having heat pump assemblies coupled on the input side and output side
US11137172B2 · kind B2 · utility
1Cited by
5References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2019 |
| Grant date | Oct 5, 2021 |
| Priority date | — |
| Expiry date | Sep 13, 2039 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2400/22
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat pump system includes a first heat pump arrangement having a compressor having a compressor output; a second heat pump arrangement having an input portion and an output portion; and a coupler for thermally coupling the first heat pump arrangement and the second heat pump arrangement, the coupler including a first heat exchanger and a second heat exchanger, the first heat exchanger being connected to the input portion of the second heat pump arrangement, and the second heat exchanger being connected to the output portion of the second heat pump arrangement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.