Force sensor with MEMS-based device and force touching member
US11137296B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | May 30, 2019 |
| Grant date | Oct 5, 2021 |
| Priority date | — |
| Expiry date | May 30, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A force sensor includes a package substrate, a MEMS-based device, a package body and a force touching member. The MEMS-based device is disposed on the package substrate and electrically connected with the package substrate. The package body encapsulates the MEMS-based device. The force touching member including a rod is disposed on the package body and corresponding to the MEMS-based device. The force sensor allows a greater assembly tolerance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.