Patent · US Active

Thermally insulated microsystem

US11137364B2 · kind B2 · utility

0Cited by

3References

14Claims

0Family size

Assignee

Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE

Inventors

Thomas Lisec · Itzehoe, DE
Hans-Joachim Quenzer · Berlin, DE

Key dates

Filing date	Sep 27, 2017
Grant date	Oct 5, 2021
Priority date	—
Expiry date	Sep 27, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/8592
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

This invention provides a microsystem comprising a porous thermal insulation body composed of particles of low thermal conductivity. The porous body isolates and stabilizes the microsystem.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.