Wafer-level homogeneous bonding optical structure and method to form the same
US11137581B2 · kind B2 · utility
0Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2018 |
| Grant date | Oct 5, 2021 |
| Priority date | — |
| Expiry date | Mar 27, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8063
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A wafer-level homogeneous bonding optical structure includes two optical lens sets disposed on an optically transparent wafer and a spacer disposed on the optically transparent wafer and between the two optical lens sets. The spacer is homogeneously bonded to and integrated with the optically transparent wafer in the absence of a heterogeneous adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.