Patent · US Active

Fingerprint module and electronic device

US11138403B2 · kind B2 · utility

0Cited by

0References

20Claims

0Family size

Assignee

Honor Device Co., Ltd. · CN

Inventors

Kuibing Zhao · Beijing, CN
Wenping Guo · Lo Wu, CN
Dong Ma · Beijing, CN

Key dates

Filing date	May 27, 2016
Grant date	Oct 5, 2021
Priority date	—
Expiry date	May 27, 2036

Classification

Technology area (CPC G)Physics
CPC primaryG06F1/1684
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A fingerprint module includes a fingerprint component, a button component, a support, and a resilient fixing element. The button component is fastened to a lower surface of the fingerprint component. The resilient fixing element is disposed on the lower surface of the fingerprint component and is located between the fingerprint component and the support. The resilient fixing element surrounds the button component, and the resilient fixing element resiliently connects the fingerprint component and the support. There is a gap between the button component and the support. When the fingerprint component is pressed, the resilient fixing element deforms, the gap becomes smaller, and the button component comes in contact with the support.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.