Electronic device including hermetic micro-cavity and methods of preparing the same
US11139164B2 · kind B2 · utility
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19Claims
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Key dates
| Filing date | Dec 12, 2019 |
| Grant date | Oct 5, 2021 |
| Priority date | — |
| Expiry date | Dec 25, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16227
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device includes: a water impermeable substrate; at least one electronic circuit on the water impermeable substrate; a dielectric encapsulant on the electronic circuit; a capping layer comprising a polymer on the dielectric encapsulant; and a barrier layer on the capping layer, the water impermeable substrate, the dielectric encapsulant, the capping layer, and the barrier layer forming a hermetically sealed micro-cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.