Semiconductor device
US11139263B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2020 |
| Grant date | Oct 5, 2021 |
| Priority date | — |
| Expiry date | Apr 13, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/066
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprising at least a semiconductor component, a heat sink, a connecting element and an electrical circuit connected to the heat sink in an electrically conductive manner; wherein the semiconductor component and the heat sink are arranged at a distance from one another and are electrically and thermally conductively connected via the connecting element, wherein an electrical current can be supplied to the electrical circuit via the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.