Patent · US Active

Semiconductor device

US11139263B2 · kind B2 · utility

0Cited by
3References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 13, 2020
Grant dateOct 5, 2021
Priority date
Expiry dateApr 13, 2040

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2201/066
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A semiconductor device comprising at least a semiconductor component, a heat sink, a connecting element and an electrical circuit connected to the heat sink in an electrically conductive manner; wherein the semiconductor component and the heat sink are arranged at a distance from one another and are electrically and thermally conductively connected via the connecting element, wherein an electrical current can be supplied to the electrical circuit via the heat sink.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.