Method for fabricating a throughput-scalable analytical system for molecule detection and sensing
US11139336B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 18, 2020 |
| Grant date | Oct 5, 2021 |
| Priority date | — |
| Expiry date | Dec 18, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J2001/446
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for fabricating a throughput-scalable sensing system is disclosed. The method includes receiving a first semiconductor wafer and a second semiconductor wafer. The first semiconductor wafer includes a semiconductor substrate and a plurality of sensors disposed in the semiconductor substrate. Each sensor of the plurality of sensors is disposed in a separate semiconductor die of the first semiconductor wafer. The method further includes bonding the first semiconductor wafer to the second semiconductor wafer and preparing the bonded first semiconductor wafer and the second semiconductor wafer for conductive path redistribution. The method further includes forming one or more redistribution paths and dicing an array of semiconductor dies as a group from the plurality of semiconductor dies. The array of semiconductor dies includes a group of sensors associated with the throughput-scalable sensing system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.