Metal dendrite-free solar cell

US11139407B2 · kind B2 · utility

Assignee

• The Boeing Company · US

Inventors

• Xiaobo ZHANG · Shanghai, CN
• Vincent A. Lim · Los Angeles, US
• Hoon Hui Lee · Gunpo-si, KR
• John P. Serra · Camarillo, US
• Uming T. Jeng · Rosemead, US
• Steven M. Bunyan · San Fernando, US
• Julie J. Hoskin · Santa Monica, US
• Kent E. Barbour · Simi Valley, US
• Dimitri D. Krut · Sylvia Park, US

Key dates

• Filing date: Jan 16, 2019
• Grant date: Oct 5, 2021
• Expiry date: Jan 16, 2039

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50

Abstract

A method for forming a solar cell including steps of (1) providing a semiconductor wafer having an upper surface; (2) applying an electrical contact material to the upper surface, the electrical contact material forming an electrically conductive grid that includes grid lines extending from a bus bar; (3) forming an isolation channel in the semiconductor wafer to define a solar cell portion and a wing portion, wherein the wing portion is electrically isolated from the solar cell portion, and wherein the wing portion is substantially free of the electrical contact material; (4) submerging the semiconductor wafer in a solvent, wherein formation of metal dendrites on the grid lines of the electrically conductive grid is inhibited; and (5) separating the solar cell portion from the wing portion.