Electrical coupling assemblies and methods for optoelectronic modules

US11139412B2 · kind B2 · utility

Assignee

• II-VI DELAWARE, INC. · US

Inventors

• Tao Sun · Nanjing, CN
• Feng Wang · Redmond, US
• Wei Peng Nian · Shanghai, CN
• Ting Shi · Shanghai, CN
• Bing QIU · Bound Brook, US
• Shao Jun Yu · Sunnyvale, US

Key dates

• Filing date: May 22, 2019
• Grant date: Oct 5, 2021
• Expiry date: May 22, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/14
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

In one example embodiment, a PCBA, an optoelectronic module, an electrical coupling, and/or a high speed interconnect may include a first contact pad, a second contact pad adjacent to and spaced apart from the first contact pad, a first wire coupled to the first contact pad via a first ball bump, and a second wire coupled to the second contact pad via a double ball bump.