Improving stability of thin film transistors
US11139434B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 19, 2017 |
| Grant date | Oct 5, 2021 |
| Priority date | — |
| Expiry date | Oct 8, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K10/462
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A technique comprising: producing an unencapsulated stack of layers defining one or more electronic devices including an organic semiconductor element; and then subjecting the unencapsulated stack of layers to a water removal treatment in a vacuum oven in the presence of an external water adsorbent; wherein the water removal treatment comprises heating the unencapsulated stack of layers in the vacuum oven for a time period longer than a control time period at which a spike in oven pressure attributable to the release of water from the stack of layers would occur with heating under the same treatment conditions but without the water absorbing material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.