Power electronic module
US11139732B2 · kind B2 · utility
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1References
8Claims
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Assignee
Inventors
Key dates
| Filing date | Nov 20, 2018 |
| Grant date | Oct 5, 2021 |
| Priority date | — |
| Expiry date | Nov 20, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02M1/327
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Power electronic module comprising a plurality of semiconductor power electronic components electrically connected to an electrical support, and a cooling device in thermal contact with each component, each component being present between the electrical support and the cooling device and being mounted on the electrical support via at least one electrically conductive spring element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.