Flexible circuit board and method for manufacturing the same
US11140769B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 29, 2020 |
| Grant date | Oct 5, 2021 |
| Priority date | — |
| Expiry date | Jun 29, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09063
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible circuit board capable of transmitting high frequency signals with reduced attenuation includes two outer wiring boards enclosing an inner wiring board. The inner wiring board includes a first conductive wiring layer and a first substrate layer. The first conductive wiring layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductive wiring layer and defines first through holes which expose the signal line. Each of the two outer wiring boards includes a second substrate layer and a second conductive wiring layer. The second substrate layer abuts the inner wiring board and defines second through holes aligning with the first through holes, to partially surround the signal line with air of very low dielectric constant. A method for manufacturing the flexible circuit board is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.