Method of making a rigid/flex circuit board
US11140776B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 13, 2019 |
| Grant date | Oct 5, 2021 |
| Priority date | — |
| Expiry date | Dec 13, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/058
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Manufacturing a rigid-flex circuit board includes providing an inner flexible circuit board and a first flexible metal clad laminate, laminating the first flexible metal clad laminate on a surface of the inner flexible circuit board through a first adhesive film, causing the first copper layer to form a third conductive circuit layer, partially covering the metal protective layer exposed by the third conductive circuit layer, removing the metal protective layer exposed by the third conductive circuit layer and the covered area, providing a second copper foil, laminating the second copper foil on a surface of the third conductive circuit layer through a second adhesive film, removing the metal protective layer at the opening area, and causing the second copper foil to form a fifth conductive circuit layer. The first flexible metal clad laminate includes a second base material layer, a metal protective layer, and a first copper layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.