Component mounting method, component mounting system, and manufacturing method of component mounting board
US11140788B2 · kind B2 · utility
0Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2019 |
| Grant date | Oct 5, 2021 |
| Priority date | — |
| Expiry date | Nov 17, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0139
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In component mounting for mounting a pin connecting component having a pin on a board having a through-hole electrode, a solder paste is printed on the through-hole electrode through a screen mask having an opening corresponding to the through-hole electrode, a flux is transferred onto the pin by holding the pin connecting component and immersing the pin into a flux tank filled with the flux, and the pin onto which the flux is transferred is inserted into the through-hole electrode on which the solder paste is printed to mount the pin connecting component on the board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.