Apparatus for enhancing cooling of an electronic computing device and method of use
US11140797B1 · kind B1 · utility
0Cited by
24References
16Claims
0Family size
Inventors
Key dates
| Filing date | Jul 31, 2020 |
| Grant date | Oct 5, 2021 |
| Priority date | — |
| Expiry date | Jul 31, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20145
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for cooling an electronic computing device is provided that includes a cooling pad. The cooling pad includes a housing and a top which has openings. A cooling object is positioned within the housing and an electronic computing device is positioned on the cooling pad top. Air within the housing flows through the openings in the cooling pad top to cool the electronic computing device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.