Forging assembly having capacitance sensors
US11141767B2 · kind B2 · utility
0Cited by
11References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2018 |
| Grant date | Oct 12, 2021 |
| Priority date | — |
| Expiry date | Mar 15, 2039 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF05D2240/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A forging assembly may comprise a first die and a second die configured to translate toward the second die. A first sensor may be coupled to at least one of the first die or the second die. The first sensor may be configured to output a first signal correlating to a first distance between the first die and the second die. Additional sensors may be applied to track die alignment during the forging process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.