Cutting tool having partially-removed film formed thereon
US11141801B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2020 |
| Grant date | Oct 12, 2021 |
| Priority date | — |
| Expiry date | Apr 13, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23C2228/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a cutting tool, which performs, like a drill or a ball end mill, cutting while rotating in a state in which the center of the tip end is in contact with a work material, and includes a wear-resistant layer formed at the tip end thereof, wherein a portion of the wear-resistant layer is selectively removed through tip end polishing from the center of the tip end of the drill or the ball end mill to a predetermined area, so as to restrain micro-brittle wear generated in an ultra-low speed region, and thus remarkably improving the cutting lifespan of the cutting tool such as the drill or the ball end mill.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.