Patent · US Active

Wire automatic soldering system

US11141807B2 · kind B2 · utility

0Cited by

4References

20Claims

0Family size

Assignees

Inventors

Fengchun Xie · Shanghai, CN
Dandan Zhang · Shanghai, CN
Roberto Francisco-Yi Lu · Bellevue, US
Lvhai Hu · Shanghai, CN
Qinglong Zeng · Lo Wu, CN
Lan Gong · Shanghai, CN
Qian Ying · Shanghai, CN
Yingcong Deng · Shanghai, CN
Yun Liu · Shanghai, CN

Key dates

Filing date	Nov 15, 2019
Grant date	Oct 12, 2021
Priority date	—
Expiry date	Nov 15, 2039

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2101/38
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.