Non-eutectic bonding
US11141810B2 · kind B2 · utility
0Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2017 |
| Grant date | Oct 12, 2021 |
| Priority date | — |
| Expiry date | Oct 4, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/94
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a method of forming a joint bonding together two solid objects and joints made by the method, where the joint is formed by a layer of a binary system which upon heat treatment forms a porous, coherent and continuous single solid-solution phase extending across a bonding layer of the joint.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.