Photosensitive resin composition, etching method and plating method
US11142620B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2018 |
| Grant date | Oct 12, 2021 |
| Priority date | — |
| Expiry date | Jul 8, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/40
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive resin composition which comprises (A) an alkali-soluble resin, (B) a photopolymerization initiator and (C) an acrylate monomer and may further comprise (D) a methacrylate monomer, wherein the acrylate monomer (C) comprises (C1) an acrylate monomer having a double bond equivalent of not less than 250 and (C2) azo acrylate monomer having a double bond equivalent of not more than 150, the content of the methacrylate monomer (D) is 0 to 5 mass %, the content of the acrylate monomer having a double bond equivalent of not less than 250 (C1) is 40 to 60 mass %, and the content of the acrylate monomer having a double bond equivalent of not more than 150 (C2) is 40 to 60 mass % based on the acrylate monomer (C), and the content of the photopolymerization initiator (B) is 0.5 to 1.5 mass % based on the photosensitive resin composition, and an etching method and plating method using the above photosensitive resin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.