Adhesive composition comprising metal nanoparticles
US11142671B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2019 |
| Grant date | Oct 12, 2021 |
| Priority date | — |
| Expiry date | Jan 15, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2203/326
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of metal nanoparticle shaving an average particle size ranging from about 0.5 nanometers to about 100 nanometers, and at least one solvent. Also provided herein is an electronic device comprising a substrate, conductive features disposed on the substrate, a conductive electrical component disposed over the conductive features, and a conductive adhesive composition disposed between the conductive features and the conductive electrical component. Further disclosed herein are methods of making a conductive adhesive composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.