Patent · US Active

Packaging for electronics in downhole assemblies

US11143017B2 · kind B2 · utility

1Cited by

16References

20Claims

0Family size

Assignee

Baker Hughes, a GE company, LLC · US

Inventors

Weiqiang Wang · Shanghai, CN
Robert Reinertsen · Spring, US
Edward Glenn Burroughs · Chandler, US
Bernd Dreyer · Taunusstein, DE
Cord Simon Huber · Gehrden, DE

Key dates

Filing date	Jun 9, 2017
Grant date	Oct 12, 2021
Priority date	—
Expiry date	Dec 2, 2037

Classification

Technology area (CPC E)Fixed Constructions
CPC primaryE21B47/0175
WIPO fieldCivil engineering
WIPO sectorOther fields

Abstract

A downhole device configured to be inserted into a borehole includes a device body having an outer surface and a recess formed in the outer surface, a cover covering the recess to form a first cavity, and a shock-absorber configured to support an electrical module within the first cavity, the shock-absorber disposed between a base of the first cavity and the cover opposite the base. The downhole device also includes a vibration-damping layer disposed between the base of the first cavity and the cover, the vibration-damping layer configured to dampen vibration of the electrical module.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.