Method of manufacturing light emitting module and light emitting module
US11143807B2 · kind B2 · utility
0Cited by
2References
26Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 29, 2020 |
| Grant date | Oct 12, 2021 |
| Priority date | — |
| Expiry date | Jul 29, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/855
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a light emitting module according to the present disclosure includes: preparing a light guide plate that comprises a first main surface serving as a light-emitting surface and a second main surface opposite to the first main surface; respectively providing light emitting elements on the second main surface so as to correspond to each of a plurality of optically functional portions provided on the first main surface of the light guide plate; and forming wires electrically connecting the plurality of light emitting elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.