Semiconductor chip
US11145607B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2020 |
| Grant date | Oct 12, 2021 |
| Priority date | — |
| Expiry date | Apr 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip includes a compound semiconductor substrate having a pair of main surfaces and a side surface therebetween, a circuit on one main surface of the pair of main surfaces, and first metals on the main surface. The first metals are positioned, in plan view of the main surface, closer to an outer edge of the main surface than the circuit, substantially in a ring shape to surround the circuit with gaps between first metals adjacent to each other. The semiconductor chip further includes second metals on the main surface. The second metals are positioned, in plan view of the main surface, between the circuit and the first metals or closer to the outer edge than the first metals. Also, the second metals each are positioned, in plan view of the side surface, such that at least a part thereof overlaps a gap between the first metals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.