Multiple step edge fabrication
US11145802B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2019 |
| Grant date | Oct 12, 2021 |
| Priority date | — |
| Expiry date | Oct 18, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N69/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
This disclosure relates to fabrication of step edges to fabricate Josephson junctions. A method comprises forming a layer of resist over the surface. The layer of resist comprises openings to expose a selected area of the surface, thereby forming two walls in the layer of resist on a perimeter of the selected area. The resist and the substrate are exposed to an ion beam, thereby etching the resist and the exposed areas of the surface. While exposing the resist and the substrate to the ion beam, the substrate is gradually rotated about an axis normal to the surface to thereby form two step edges at the respective two walls. Further, superconducting material is deposited onto the substrate in a meandering shape to form a path that crosses the two step edges multiple times and to form a Josephson junction each time the path crosses the step edges.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.