Method for manufacturing electroluminescent device
US11145844B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 21, 2020 |
| Grant date | Oct 12, 2021 |
| Priority date | — |
| Expiry date | Mar 31, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/122
Abstract
A method of manufacturing an electroluminescent device includes the following steps. A substrate including a first sub-pixel region and a second sub-pixel region is provided. A first light-emitting layer is formed over the substrate through a shadow mask to cover the first sub-pixel region and at least a portion of the second sub-pixel region. A sacrificial layer is formed over the substrate, wherein the sacrificial layer includes an opening exposing a portion of the first light-emitting layer that is over the second sub-pixel region. The portion of the first light-emitting layer that is over the second sub-pixel region is removed. A second light-emitting layer is formed over the sacrificial layer and on the second sub-pixel region through the opening of the sacrificial layer. The sacrificial layer is removed simultaneously with a portion of the second light-emitting layer that is over the sacrificial layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.