Patent · US Active

Method for manufacturing camera modules and a camera module array

US11146712B2 · kind B2 · utility

0Cited by

10References

23Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Adrian Severin Matusek · Leinfelden, DE
Andreas Kugler · Alfdorf, DE
Stefan Apelt · Gerlingen, DE
Ulrich Schaaf · Kaisersbach, DE

Key dates

Filing date	Sep 17, 2018
Grant date	Oct 12, 2021
Priority date	—
Expiry date	May 17, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH10F39/804
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method for manufacturing a camera module array, made up of at least two camera modules, each camera module including a circuit carrier, an image sensor and at least one optical element, including: mounting the image sensor on the circuit carriers;applying a protective layer to the circuit carriers, the image sensors not being covered by the protective layer or being left exposed; and mounting the optical elements on the image sensors with the aid of an injection molding process and/or embossing process.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.