Sensor system, sensor arrangement, and assembly method using solder for sealing
US11146893B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 17, 2018 |
| Grant date | Oct 12, 2021 |
| Priority date | — |
| Expiry date | Sep 17, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1147
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a sensor arrangement, to a corresponding method of assembling such a sensor arrangement, and to a sensor system. The sensor arrangement comprises at least one transducer element for monitoring at least one measurand and generating an electrical output signal correlated with the at least one measurand; and a sensor substrate comprising the transducer element. The sensor substrate is mountable on a circuit carrier in a way that a media channel penetrating the circuit carrier allows access of the at least one measurand to the transducer element. The circuit carrier has an electrically conductive solderable first sealing pattern which surrounds the media channel at least partly and which is aligned with a solderable second sealing pattern arranged on the sensor substrate, so that a soldered sealing connection, which at least partly surrounds the media channel, is formed between the first sealing pattern and the second sealing pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.