Patent · US Active

Method and apparatus for filamentation of workpieces not having a plan-parallel shape, and workpiece produced by filamentation

US11148231B2 · kind B2 · utility

0Cited by
18References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 5, 2018
Grant dateOct 19, 2021
Priority date
Expiry dateJan 9, 2039

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB23K2101/40
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A method for filamentation of a dielectric workpiece has a workpiece with a thickness between 0.5 and 20 mm is provided. The workpiece has boundary surfaces delimiting the workpiece. The thickness of the workpiece varies spatially and/or at least one of the boundary surfaces delimiting the workpiece has at least one curvature with a radius of curvature between 0.1 μm and 10 m. The dielectric workpiece can have a specially formed edge.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.