Method and apparatus for filamentation of workpieces not having a plan-parallel shape, and workpiece produced by filamentation
US11148231B2 · kind B2 · utility
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18References
19Claims
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Key dates
| Filing date | Apr 5, 2018 |
| Grant date | Oct 19, 2021 |
| Priority date | — |
| Expiry date | Jan 9, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for filamentation of a dielectric workpiece has a workpiece with a thickness between 0.5 and 20 mm is provided. The workpiece has boundary surfaces delimiting the workpiece. The thickness of the workpiece varies spatially and/or at least one of the boundary surfaces delimiting the workpiece has at least one curvature with a radius of curvature between 0.1 μm and 10 m. The dielectric workpiece can have a specially formed edge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.