Method and device for removing material from a substrate
US11148246B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2019 |
| Grant date | Oct 19, 2021 |
| Priority date | — |
| Expiry date | Apr 8, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB64F5/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A material removal device for removing material from a substrate includes a holder extending between first and second sides and a grinding wheel supported by the holder and being operable to remove the material from the substrate. The holder has a guide frame at the first side and a support frame at the second side. The guide frame has a first bottom surface and the support frame has a second bottom surface. The first and second bottom surfaces are vertically offset from each other. The grinding wheel has an axle supported by the guide frame and the support frame. The grinding wheel has a grinding surface located below the first bottom surface and above the second bottom surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.